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제품특징 | 제품사양 | 자료실 |
Description
The Beam Imaging System (BIS) allows the user to detect and evaluate particle beam cross sections in
real-time in a high vacuum or ultra high vacuum environment. It creates an image of the beam by converting
the incident beam signal into visible light which can be monitored through the glass vacuum window.
In detail, the system comprises a linear feedthrough for moving the BIS in and out of the charged particle
beam axis, high voltage feedthroughs, as well as a glass viewport mounted onto a DN 100 CF support flange.
The actual BIS inside the vacuum chamber consists of a chevron-type micro channel plate (MCP)
for low-current signal amplification, a phosphor screen for signal conversion to visible light, a mirror,
and a CCD camera including a macro zoom lens.
In case medium beam intensities are to be analyzed which do not require MCP amplification,
the system is delivered with the phosphor screen only.
Via the CCD camera a digital image of the beam can be transferred to a PC for further analysis.
The complete beam imaging system can be remote controlled which is important if access to the beamline
is limited during beam operation. A control software and a PC system with the installed software are optionally available.
제품특징 | 제품사양 | 자료실 |
Parameters
Beam Imaging System Parameters | |
beam current range | 0.1 pA ... 500 nA |
beam energy acceptance | 10 ... 60 keV (higher energies on request) |
max. detectable beam diameter | 25 mm, 40 mm (larger diameters on request) |
vertical travel | min. 50 mm (at 25 mm diameter) or 100 mm (at 40 mm diameter) (other travel distances on request) |
General Parameters | |
mounting flange | DN 160 CF |
height | 480 mm |
weight | 10 kg (22 lbs) |
max. bakeout temperature | 150 °C |
Infrastructural Requirements | |
vacuum conditions during operation | suitable from 1e-10 mbar up to 1e-6 mbar |
DOWNLOAD ProductSheet_BeamImagingSystem.pdf